Bio-based epoxy mold compound for electronic devices
AssigneeSanDisk Technologies LLC
InventorsVIGNESHWARRAM KUMARESAN, VISHNU CHANDAR JANAKIRAMAN, MUTHARASU DEVARAJAN
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Abstract
A bio-based epoxy molding compound (EMC) is comprised of over ninety percent bio-based and/or biodegradable materials such as, basalt fillers, bio-based epoxy resins, bio-based releasing agents and bio-based stress modifiers. The bio-based EMC is a sustainable alternative to conventional EMCs and provides enhanced mechanical strength, enhanced thermal stability and performance, and enhanced chemical resistance when compared with conventional EMCs.
Claims20
An epoxy molding compound (EMC) for an electronic device, comprising:
- a bio-based filler material having a first weight percentage in a range of sixty weight percentage and ninety weight percentage of a total material composition of the EMC;
- and
- a bio-based epoxy resin having a second weight percentage in a range of one weight percentage and a thirty weight percentage of the total material composition of the EMC.
An epoxy molding compound (EMC) for an electronic device, comprising:
- a bio-based filling means having a first weight percentage in a range of sixty weight percentage and ninety weight percentage of a total material composition of the EMC;
- and
- an epoxy resin means having a second weight percentage in range of one weight percentage and thirty weight percentage of the total material composition of the EMC.
An electronic device, comprising:
- a substrate;
- a semiconductor die communicatively coupled to the substrate;
- and
- a bio-based epoxy molding compound (EMC) encapsulating the semiconductor die, the bio-based EMC being comprised of at least ninety percent by weight of bio-based materials.
Dependencies are inferred from the claim text.