Curable and cured thermosetting compositions

Abstract

Curable thermosetting compositions and cured thermoset compositions are provided. The thermoset compositions can be prepared to have a low coefficient of thermal expansion (CTE) in the range of 0 to 100 degrees Celsius, a low dielectric constant (e.g., less than 2.5), a low dielectric loss tangent (e.g., less than 0.004 at 10 GHz), or a combination thereof. The curable thermosetting compositions contain an addition polymerized polynorbornene copolymer, a bismaleimide resin with a high level of hydrocarbon content, and a thermal radical initiator.

Dependencies are inferred from the claim text.