US 2026/0144163 A1 · THREE-DIMENSION SEMICONDUCTOR DEVICE

Abstract

The present disclosure is related to a three-dimension semiconductor device comprising a first circuit layer and a second circuit layer. The first circuit layer comprises a first circuit block. The second circuit layer is disposed on the first circuit layer and comprises a second circuit block. The first circuit block and the second circuit block establish an electrical connection relationship through connecting pillars. By increasing the wiring dimension of the wiring, the present disclosure allows the first circuit block and the second circuit block, which were originally only electrically connected in two dimensions, to establish electrical connections through the third dimension. Therefore, the length of a signal transmission path is reduced. The purpose of reducing wiring length and signal delay is achieved.

Claims24

Dependent claims

A three-dimension semiconductor device, comprising:

a first circuit layer, comprising a first switch block;
and
a second circuit layer, disposed on the first circuit layer, comprising a second switch block,
wherein the second switch block and the first switch block are electrically connected via a connecting pillar, and vertical projections of the second switch block, the first switch block, and the connecting pillar at least partially overlap on the first circuit layer.

1 more element

A three-dimension semiconductor device, which comprises a first circuit layer and a second circuit layer, the first circuit layer being disposed on the second circuit layer, comprising:

a first logic circuit, disposed in the first circuit layer;
a first transmitter, disposed in the first circuit layer, electrically connected to the first logic circuit, configured to receive a first digital signal from the first logic circuit and output a first analog signal to the second circuit layer;
and
a first receiver, disposed in the first circuit layer, electrically connected to the first logic circuit, configured to receive a second analog signal from the second circuit layer, convert the second analog signal to a second digital signal and transmit the second digital signal to the first logic circuit;
wherein the first analog signal and the second analog signal are high-frequency analog signals.

2 more elements

Dependencies are inferred from the claim text.

Three-dimension semiconductor device

Life of this patent

Three-dimension semiconductor device

Life of this patent

Abstract

Claims24