Surface structure of an electrostatic chuck and method for forming the same

Abstract

A method for forming surface structure of electrostatic chuck used in semiconductor manufacturing processes is disclosed. The method includes depositing a first protective coating on a substrate and depositing a second protective coating on the first protective coating. In some embodiments, the first protective coating is formed by thermal spraying and is made from materials selected from groups comprising metal oxides, fluorides, and nitrides. The second protective coating is formed by physical vapor deposition and provides a high-density coating having a higher hardness than the first protective coating. In some embodiments, the second protective coating has a porosity of less than 1%. The resulting surface structure includes the substrate, the first protective coating disposed on the substrate, and the second protective coating disposed on the first protective coating, thereby providing enhanced wear resistance and reducing particulate contamination to improve the performance and lifespan of electrostatic chucks in semiconductor manufacturing.

Dependencies are inferred from the claim text.