Semiconductor device
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorJun SAITO
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AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorJun SAITO
Estimating the term…
A semiconductor substrate includes: a first n-type layer disposed within the peripheral region and located in a range including a corner between an upper surface and a side surface of the semiconductor substrate; a second n-type layer disposed within the peripheral region and located below the first n-type layer to be in contact with a lower electrode; and an n-type drift layer distributed across the element region and the peripheral region to have an n-type impurity concentration lower than those of the first n-type layer and the second n-type layer. The n-type drift layer is disposed between the first n-type layer and the second n-type layer and in contact with both of the first n-type layer and the second n-type layer. An anode of a diode is electrically connected to an anode electrode, and a cathode of the diode is electrically connected to the first n-type layer.
A semiconductor device comprising:
Dependencies are inferred from the claim text.