Flexible customized 3d heat pipe and its preparation method and application
AssigneeXiamen University
InventorsWei ZHOU, Jiarong CUI, Wenjun XU, Weisong LING, Xuyang CHU, Liang SU, Zheng SHEN
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AssigneeXiamen University
InventorsWei ZHOU, Jiarong CUI, Wenjun XU, Weisong LING, Xuyang CHU, Liang SU, Zheng SHEN
Estimating the term…
A flexible customized 3D heat pipe, its preparation method, and application are provided. The customized 3D heat pipe partially contacts a control chip to absorb heat generated by the control chip. The remaining part of the customized 3D heat pipe can be laid along any three-dimensional path within an electronic device as needed. The heat accumulated by the control chip is then transferred to any spatial region within the electronic device where the customized 3D heat pipe is laid. This maximizes the heat dissipation area of the heat pipe without affecting the volume of the electronic device or the installation space of other components. Compared to traditional 2D flat heat pipes, it enables more efficient thermal management for electronic devices.
A preparation method for a customized three dimensional (3D) heat pipe, wherein the customized 3D heat pipe is disposed in an electronic device and partially contacts a control chip of the electronic device, and comprises a flexible housing, a flexible wick, and a working fluid;
Dependencies are inferred from the claim text.