Method of enabling a remote heatsink using a thermoacoustic heat pump in a computing device

An apparatus comprising:

• a heat sink in a computing device;
• a resonance tube in the computing device extending from a fan and past the heat sink and past a component of the computing device, wherein the resonance tube is thermally coupled to the heat sink and to the component;
• a driver connected at an end of the resonance tube adjacent to the fan, wherein sound from the fan moves the driver to induce sound waves within the resonance tube;
• a cold heat exchanger within the resonance tube at a component location where the component is coupled to the resonance tube;
• a hot heat exchanger within the resonance tube at a heat sink location where the heat sink is coupled to the resonance tube;
• and
• a stack within the resonance tube spanning between the cold heat exchanger and the hot heat exchanger,
• wherein the cold heat exchanger, the hot heat exchanger, and the stack each comprise a porous material configured to transfer heat,
• wherein a length of the resonance tube is selected to correspond to a fan sound frequency of sound emanating from the fan, wherein sound waves at the fan sound frequency resonate within the resonance tube at the fan sound frequency, and
• wherein heat from the component is transferred to the resonance tube and travels in the resonance tube to a location where the heat sink is coupled to the resonance tube and exits to the heat sink.

A system comprising:

• a computing device comprising a processor;
• a fan configured to provide cooling to the processor;
• a component within the computing device;
• a heat sink within the computing device;
• a resonance tube in the computing device extending from the fan and past the heat sink and past the component of the computing device, wherein the resonance tube is thermally coupled to the heat sink and to the component;
• and
• a driver connected at an end of the resonance tube adjacent to the fan, wherein sound from the fan moves the driver to induce sound waves within the resonance tube,
• wherein a length of the resonance tube is selected to correspond to a fan sound frequency of sound emanating from the fan, wherein sound waves at the fan sound frequency resonate within the resonance tube at the fan sound frequency, and
• wherein heat from the component is transferred to the resonance tube and travels in the resonance tube to a location where the heat sink is coupled to the resonance tube and exits to the heat sink.