Optical fiber management apparatus for co-packaged optics switch chip

Abstract

This application relates to an optical fiber management apparatus for co-packaged optics switch chip. The apparatus includes: a support substrate including a first surface; an optical fiber storage box disposed on the first surface of the support substrate; and a cable management structure disposed on the first surface of the support substrate and including: a cable management portion having a first optical fiber outlet; and a first optical fiber storage space having a second optical fiber outlet, where the first optical fiber outlet is configured to allow an optical fiber in the cable management portion to extend into the first optical fiber storage space, the second optical fiber outlet is configured to allow the optical fiber in the first optical fiber storage space to extend into the optical fiber storage box, and the first optical fiber storage space is configured to accommodate a first redundant portion of the optical fiber.

Dependencies are inferred from the claim text.