Thermistor spacers
AssigneeGM Cruise Holdings LLC
InventorsDaniel Beckmeier, Howard Davidson, Jie Liu, Fen Chen
Life of this patent
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Abstract
A method includes forming a temperature measurement assembly comprising a plurality of thermally coupled layers of a first thermally conductive material, wherein an inner layer of the plurality of thermally coupled layers comprises one or more voids defined therein, wherein each void receives a thermistor secured in the void using a second thermally conductive material that thermally couples the thermistor to the inner layer. The method also includes positioning the temperature measurement assembly on and in thermal communication with a surface of a device, and measuring temperatures of the surface of the device using the thermistors.
Claims20
An assembly configured to measure a temperature of a surface of a device, the assembly comprising:
- a first sheet comprising a first thermally conductive material;
- a spacer comprising:
- a second thermally conductive material;
- one or more voids defined in the second thermally conductive material;
- one or more thermistors received in respective ones of the one or more voids;
- and
- a third thermally conductive material in the one or more voids to secure the one or more thermistors in the one or more voids and to thermally couple the one or more thermistors to the second thermally conductive material;
- and
- a second sheet comprising a fourth thermally conductive material,
- wherein the first sheet is affixed and thermally coupled to a first surface of the spacer,
- wherein a second surface of the second sheet is affixed and thermally coupled to a third surface of the spacer, and
- wherein a fourth surface of the second sheet is configured to be thermally coupled to the surface of the device.
A method comprising:
- forming a first sheet of a first thermally conductive material;
- forming a spacer of a second thermally conductive material;
- defining one or more voids in the second thermally conductive material;
- positioning one or more thermistors in respective ones of the one or more voids;
- and
- applying a third thermally conductive material in the one or more voids to secure the one or more thermistors in the one or more voids and thermally couple the one or more thermistors to the second thermally conductive material;
- forming a second sheet of a fourth thermally conductive material;
- affixing and thermally coupling the first sheet to a first surface of the spacer;
- and
- affixing and thermally coupling a second surface of the second sheet to a third surface of the spacer.
A method comprising:
- forming a temperature measurement assembly comprising a plurality of thermally coupled layers of a first thermally conductive material, wherein an inner layer of the plurality of thermally coupled layers comprises one or more voids defined therein, wherein each void receives a thermistor secured in the void using a second thermally conductive material that thermally couples the thermistor to the inner layer;
- positioning the temperature measurement assembly on and in thermal communication with a surface of a device;
- and
- measuring temperatures of the surface of the device using the thermistors.
Dependencies are inferred from the claim text.