Transparent invisible multilayer structure and preparation method thereof

A preparation method of a transparent invisible multilayer structure, the preparation method comprising the steps of:

• providing a transparent carrier film and coating a layer of a transparent liquid coating onto a side of the transparent carrier film;
• providing a transfer mold with preformed protrusions, pressing the preformed protrusions of the transfer mold against the transparent liquid coating, curing the transparent liquid coating, and peeling off the transfer mold after the curing, with recesses matching the preformed protrusions in shape formed on a resulting cured liquid coating, thereby obtaining a recessed see-through layer;
• printing, by a planographic printing process, a decorative layer on a surface, excluding the recesses, of a side of the recessed see-through layer away from the transparent carrier film, such that second through holes interconnected with the recesses respectively are provided at positions, corresponding to the recesses, of the decorative layer;
• and
• printing, by the planographic printing process, a light shielding layer on a surface, excluding the second through holes, of a side of the decorative layer away from the transparent carrier film, such that first through holes interconnected with the second through holes are provided at positions, corresponding to the second through holes, of the light shielding layer, and the first through holes are interconnected with the recesses via the second through holes to form light-transmitting holes respectively, thereby obtaining a multilayer structure.