US 2026/0136873 A1 · SURFACE MOUNT DEVICE FOR COLORFUL CHIPS AND COLORFUL CHIPS SURFACE MOUNT METHOD

Abstract

This disclosure is directed to a surface mount device for colorful chips. The surface mount device has a base, a first transferring mechanism, a second transferring mechanism, a frame, a color identification module and a punching mechanism. The base carries the circuit board, the first transferring mechanism is arranged on the base, and the second transferring mechanism is arranged on the first transferring mechanism. The frame carries the transparent film. The frame is arranged on the first transferring mechanism and above the base. The frame has a window, and a side of the transparent film carrying the colored crystal grains faces to the circuit board. The color identification module is aligned to an area defined in the window. The color identification module is suspended on the frame. The punching mechanism is arranged on the second transferring mechanism and suspended over the window.

Claims12

Dependent claims

A surface mount device for colorful chips for mounting a plurality of colorful chips carried on a transparent film on to a circuit board, the surface mount device for colorful chips comprising:

a base for carrying the circuit board;
a first transferring mechanism, arranged on the base;
a second transferring mechanism, arranged on the first transferring mechanism;
a frame for carrying the transparent film, arranged on the first transferring mechanism so as to be hung above the base, the frame comprising a window allowing a surface of the transparent film carrying the colorful chips to face the circuit board and the colorful chips arranged in an area corresponding to inside of the window;
a color identification module, hung above the frame;
and
a punching mechanism, arranged on the second transferring mechanism and hung over the window.

4 more elements

A colorful chips surface mount method, comprising:

a) providing a circuit board and a transparent film carrying a plurality of colorful chips, the circuit board comprising a mount surface, the mount surface defined with a plurality of mount positions corresponding to the colorful chips, and disposing one surface on the transparent film carrying the colorful chips toward the mount surface of the circuit board;
b) providing a color identification module, recognizing positions of the colorful chips on the transparent film by the color identification module;
c) providing a punching mechanism, disposing the punching mechanism corresponding to another surface on the transparent film opposite to the colorful chips;
and
d) moving the transparent film to correspondingly align one of the colorful chips on the transparent film to one of the mount positions on the circuit board, moving the punching mechanism to align the mount position, pressing the transparent film by the punching mechanism to transfer the colorful chip to the mount position, and respectively processing the colorful chips in sequence.

2 more elements

Dependencies are inferred from the claim text.

Surface mount device for colorful chips and colorful chips surface mount method

Life of this patent

Surface mount device for colorful chips and colorful chips surface mount method

Life of this patent

Abstract

Claims12