Multilayer bandpass filter

A multilayer electronic component comprising:

• a multilayer body including a plurality of dielectric layers laminated in a stacking direction;
• and
• a resonator circuit embedded within the multilayer body, the resonator circuit comprising:
• a first vertical conductor and a second vertical conductor extending in the stacking direction;
• and
• a horizontal conductor pattern connecting upper ends of the first and second vertical conductors;
• wherein the first and second vertical conductors and the horizontal conductor pattern form a conductive loop having a winding axis perpendicular to the stacking direction;
• wherein the first vertical conductor has a via length (L2) in the stacking direction;
• wherein a gap between inner facing surfaces of the first and second vertical conductors defines a line length (L1);
• and
• wherein the resonator circuit is configured such that the via length (L2) is greater than the line length (L1).

A radio frequency module comprising:

• a multilayer body;
• and
• a bandpass filter circuit integrated within the multilayer body;
• wherein the bandpass filter circuit includes an LC resonator loop defined by:
• a top conductor trace extending in a lateral direction;
• a first via and a second via extending in a thickness direction of the multilayer body from opposing ends of the top conductor trace;
• and
• a capacitive structure connecting a bottom end of the first via and a bottom end of the second via;
• wherein a length of the first via in the thickness direction is greater than a gap between facing surfaces of the first and second vias in the lateral direction.