Semiconductor device and method of testing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsSeungmo NOH, Sang-In PARK
Life of this patent
Estimating the term…
Abstract
Disclosed is a semiconductor device including a first circuit component, a second circuit component, an interconnect configured to electrically connect the first circuit component and the second circuit component, and a test circuit connected between the first circuit component and the interconnect, and between the second circuit component and the interconnect, and the test circuit configured to measure a resistance component and a capacitance component of the interconnect.
Claims20
A semiconductor device comprising:
- a first circuit component;
- a second circuit component;
- an interconnect configured to electrically connect the first circuit component and the second circuit component;
- and
- a test circuit connected between the first circuit component and the interconnect, and between the second circuit component and the interconnect,
- wherein the test circuit is configured to measure a resistance component and a capacitance component of the interconnect.
A method of testing a semiconductor device including an interconnect connecting circuit components and a test circuit connected to the interconnect, the method comprising:
- calculating a first time constant using a first capacitance of the test circuit and a reference resistor of an external test device;
- calculating a second time constant using a second capacitance of the test circuit and the reference resistor of the external test device;
- calculating a third time constant using the first capacitance of the test circuit and the interconnect;
- calculating a fourth time constant using the second capacitance of the test circuit and the interconnect;
- and
- calculating a resistance component of the interconnect based on the first time constant, the second time constant, the third time constant, and the fourth time constant.
A method of testing a semiconductor device including an interconnect connecting circuit components and a test circuit connected to the interconnect, the method comprising:
- calculating a first time constant using a first resistor of the test circuit and a reference capacitance of an external test device;
- calculating a second time constant using a second resistor of the test circuit and the reference capacitance of the external test device;
- calculating a third time constant using the first resistor of the test circuit and the interconnect;
- calculating a fourth time constant using the second resistor of the test circuit and the interconnect;
- and
- calculating a capacitance component of the interconnect based on the first time constant, the second time constant, the third time constant, and the fourth time constant.
Dependencies are inferred from the claim text.