Mems component comprising a mems element having a cavity and comprising an asic component

A MEMS component, comprising:

• a MEMS element having a cavity;
• and
• an ASIC component, wherein the cavity is bounded at least partially by the ASIC component;
• wherein the ASIC component includes, between a top layer and a bottom layer, multiple conductor track layers one above the other along a y-direction,
• wherein the conductor track layers are connected to circuit elements of the ASIC component and/or to a sensor element and/or to an actuator element of the MEMS element,
• wherein the top layer of the ASIC component adjoins the cavity,
• wherein the conductor track layers include at least one first conductor track layer and at least one second conductor track layer,
• wherein the first conductor track layer is disposed between the second conductor track layer and the top layer,
• wherein the first conductor track layer includes at least one first conductor track,
• wherein the first conductor track includes a layer stack having an aluminum layer and a titanium layer disposed one above the other in the y-direction,
• wherein the titanium layer is disposed between the second conductor track layer and the aluminum layer, and the titanium layer has a thickness of greater than 40 nm in the y-direction,
• wherein the second conductor track layer includes a second conductor track having copper, and
• wherein the titanium layer is provided as a getter layer for binding hydrogen, wherein the hydrogen may outgas from the copper layer, wherein the titanium layer reduces or prevents the penetration of outgassing hydrogen into the cavity.