Ultrasound transducer for ivus catheters
AssigneeBoston Scientific Scimed, Inc.
InventorsMarshall Lohrenz, Robert Fagerlund, Chad Brandvold, Jaymes Olson, Andrew Brian Graveley, John Ledder
Life of this patent
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Abstract
Methods of manufacturing transducers for intravascular ultrasound catheters. An illustrative method may comprise forming a composite PZT structure, applying a backing layer, applying a metallic layered coating to the backing layer dicing the composite PZT structure and backing layer to form an array of transducer elements, wherein at least some transducer elements remain interconnected at the backing layer after dicing, applying a matching layer, and creating a connection point through the matching layer.
Claims20
A method of manufacturing an ultrasound transducer for use in an intravascular ultrasound catheter, the method comprising:
- forming a composite PZT structure;
- applying a backing layer to the composite PZT structure;
- applying a metallic layered coating to the backing layer;
- dicing the composite PZT structure and the backing layer to form an array of transducer elements, wherein two or more transducer elements remain mechanically connected at the backing layer after dicing;
- applying a matching layer to the diced composite PZT structure;
- and
- creating a connection point through the matching layer.
An ultrasound transducer for an intravascular ultrasound catheter, comprising:
- a backing layer having a lower portion and an upper portion;
- a piezoelectric layer disposed on the upper portion of the backing layer;
- a matching layer disposed on the piezoelectric layer;
- and
- a connection point formed through the matching layer;
- wherein the lower portion of the backing layer has a first length greater than a second length of the upper portion of the backing layer.
An ultrasound transducer for an intravascular ultrasound catheter comprising:
- a backing layer having a lower portion, an intermediate portion, and an upper portion;
- a piezoelectric layer disposed on the upper portion of the backing layer;
- a matching layer disposed on the piezoelectric layer;
- and
- a connection point formed through the matching layer;
- wherein the lower portion of the backing layer has a first length, the intermediate portion has a second length less than the first length, and the upper portion has a third length less than the second length.
Dependencies are inferred from the claim text.