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US 2026/0130231 A1Published application
Substrate having a metal layer comprising a marking
AssigneeSkyworks Solutions, Inc.
InventorsAtsushi Takano, Mitsuhiro Furukawa
Life of this patent
Estimating the term…
Abstract
A method of marking information on a substrate for use in a semiconductor component is provided. The method comprises providing a substrate for use in a semiconductor component, providing a metal layer on a surface of the substrate, and providing a marking within the metal layer. A method of making a die, a radio-frequency module and a wireless mobile device; as well as a substrate, a die, a radio-frequency module and a wireless mobile device is also provided.
Claims21
-19. (canceled)
A die comprising:
- a device wafer having an electronic component disposed thereon;
- and
- a cap wafer bonded to the device wafer such that the electronic component is located between the device wafer and the cap wafer, the cap wafer having a metal layer on the inner surface of the cap wafer, the metal layer comprising a marking formed in a photoresist layer deposited on the metal layer.
A die comprising:
- a device wafer having an electronic component disposed thereon;
- and
- a cap wafer bonded to the device wafer with the electronic component being disposed between the device wafer and the cap wafer, the cap wafer having a metal layer on the inner surface of the cap wafer, the metal layer comprising a marking provided on an inner surface of the cap wafer, the bonding of the cap wafer and the device wafer forming a hermetic seal around the electronic component.
A die comprising:
- a device wafer having an electronic component disposed thereon;
- and
- a cap wafer bonded to the device wafer with the electronic component being disposed between the device wafer and the cap wafer, the cap wafer having a metal layer on the inner surface of the cap wafer, the metal layer comprising a marking provided on the inner surface of the cap wafer, and the marking including one or more letters and/or numbers and each of the letters and/or numbers being formed backwards on the inner surface of the cap wafer such that when viewed through the cap wafer from an outer surface opposite the inner surface each of the letters and/or numbers are correctly oriented.
Dependencies are inferred from the claim text.