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US 2026/0128504 A1Published application
Electronic devices
AssigneeShenzhen Shokz Co., Ltd.
InventorsShuailin XIE, Chunjian LIU
Life of this patent
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Abstract
An earphone (100) comprising a case, a circuit board, and an antenna assembly is provided. The case includes a plastic substrate and reinforcing fibers mixed in the plastic substrate. The circuit board is installed in the case. The antenna assembly is mounted on a sidewall of the case and includes an antenna bracket and a Laser Direct Structuring (LDS) antenna pattern formed on the antenna bracket. The LDS antenna pattern is electrically connected to the circuit board.
Claims20
An earphone comprising
- a case including a plastic substrate and reinforcing fibers mixed in the plastic substrate;
- a circuit board installed in the case;
- and
- an antenna assembly mounted on a sidewall of the case and including an antenna bracket (221) and a Laser Direct Structuring (LDS) antenna pattern formed on the antenna bracket (221), wherein the LDS antenna pattern is electrically connected to the circuit board.
1 more element
Dependencies are inferred from the claim text.