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US 2026/0127401 A1Published application
Method and Apparatus
AssigneeTouch Biometrix Limited
InventorsMichael COWIN, Henricus DERCKX, Wilhelmus VAN LIER, Toru SAKAI
Life of this patent
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Abstract
A method of manufacturing a smartcard inlay is provided. The method includes providing a dielectric sheet; depositing, on a first major surface of the dielectric sheet, an active matrix TFT array comprising at least one conductive layer; wherein the at least one conductive layer is deposited on regions of the dielectric sheet outside of the active matrix TFT array to provide electrical connections of the inlay.
Claims20
A fingerprint sensor for incorporation into a smartcard, the sensor comprising:
- a laminar dielectric substrate comprising a first sensing zone, and a second sensing zone separate from the first sensing zone;
- wherein the first sensing zone and the second sensing zone are arranged to provide touch sensitive surfaces for sensing fingerprints on opposite faces of the smartcard.
A smartcard system comprising:
- a laminar body for a smartcard, the body having a readout circuit disposed therein, and first body connections for connecting an active matrix TFT array to the readout circuit;
- a laminar substrate carrying an active matrix TFT array on a first major surface of the laminar substrate wherein the TFT array is arranged to provide a touch sensitive area on a second major surface of the substrate, opposite to the first surface,
- the laminar substrate carrying first substrate connections for connecting the active matrix TFT array to the first body connections.
A smartcard comprising:
- an inner layer comprising a dielectric substrate having a touch sensitive TFT array deposited on a region of the substrate;
- and
- a first outer layer, covering a first surface of the inner layer, and having a window therethrough to the region of the inner layer, whereby the touch sensitive TFT array is recessed into the smartcard.
Dependencies are inferred from the claim text.