Pressure sensors and associated methods

A pressure sensor assembly comprising:

• a housing defining a central through-bore having a first end including a threaded portion configured for coupling to a pressurized system, and a second end providing a cavity;
• a ceramic capacitive sensor disposed in the cavity and configured to vary a capacitance in response to deflection of a ceramic diaphragm under applied pressure communicated through the through-bore;
• a flexible printed circuit board assembly disposed in the cavity and electrically connected to the ceramic capacitive sensor;
• a conditioner chip mounted on the flexible printed circuit board assembly and configured to convert the capacitance of the ceramic capacitive sensor into a calibrated analog voltage output;
• and
• a connector coupled to the housing at the second end and including a plurality of terminals electrically coupled to the conditioner chip.