Ultra-thin heat pipe and manufacturing method of the same
AssigneeCooler Master Co., Ltd.
InventorJen-Chih CHENG
Life of this patent
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AssigneeCooler Master Co., Ltd.
InventorJen-Chih CHENG
Estimating the term…
A heat dissipating device that includes a first plate and a second plate opposite the first plate and connected to the first plate by two opposite sidewalls. The first plate and the second plate are connected to each other at longitudinally opposite ends thereof, longitudinally extending ends of the first plate and the second plate are connected to each other by sidewalls, and the first plate, the second plate and the sidewalls enclosing an internal space of the heat dissipating device. The heat dissipating device also includes a first wick structure disposed in the internal space and contacting inner surfaces of at least one of the first plate and the second plate. The first wick structure extends longitudinally between the longitudinally opposite ends of the first plate and the second plate, and the first wick structure at least partially defines a first vapor flow channel of the heat dissipating device
A method, comprising:
The method of claim 4 further comprising flattening the metal pipe such that the first wick structure and the second wick structure are spaced away from each other and contact inner surfaces of opposite sidewalls.
Dependencies are inferred from the claim text.