Device and its application method for in-situ cutting soil in borehole

A device for in-situ cutting soil in borehole, wherein the device comprises:

• a base in which an accommodation cavity is arranged;
• a cutting mechanism, wherein the cutting mechanism is set to the base, the cutting mechanism includes a driven driving part arranged in the accommodation cavity and a cutting part located at the opposite end of the driven driving part;
• a telescopic drive mechanism, wherein the telescopic driving mechanism is arranged to the top of the base and connected to the cutting mechanism, which can drive the cutting mechanism to stretch relative to the base along its length extension direction;
• and
• a rotating drive mechanism, the rotating drive mechanism is set to the bottom of the base, the rotating driving mechanism includes an active driving part arranged in the accommodation cavity, the rotating drive mechanism is driven by the active driving part and the driven driving part to drive the cutting mechanism to rotate around the axis of its length extension direction, making the cutting part cut the soil along the plane of the axis perpendicular to the extension direction of the length.