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US 2026/0125857 A1Published application
Pcm coating on the filler material
AssigneeApt Asia Pacific Pty. Ltd.
InventorsJames Michael TRITT, Robert CORBO, Sumeet LUDDU
Life of this patent
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Abstract
A floor pavement structure exhibiting resistance to overheating, the floor pavement structure comprising at least one layer containing a phase change material. The floor pavement structure may further comprise a heat conductive sub-layer including graphite, graphene or combinations thereof, the heat conductive sub-layer being disposed between the phase change material containing layer and a substrate.
Claims15
A floor pavement structure comprising:
- at least one PCM layer comprising at least one phase change material in an effective amount to prevent overheating of the floor pavement structure.
A method of constructing a floor pavement structure, the method comprising:
- forming at least one PCM layer containing at least one PCM over at least one sub-layer in an effective amount to prevent overheating of the floor pavement structure.
Dependencies are inferred from the claim text.