Back to results
US 2026/0125815 A1Published application
Metal processing apparatus, and metal processing method using same
AssigneeKsm Technology Co., Ltd.
InventorsHong Youl RYU, Ki Hong KIM, Hwa Young WOO
Life of this patent
Estimating the term…
Abstract
The present invention relates to a metal processing apparatus, comprising: an electrolytic bath having a reaction space and forming a liquid metal to be tapped; a level measuring unit for measuring the level of the liquid metal by using an electrical signal; a tapping unit for tapping the liquid metal; and a control unit for controlling the tapping unit on the basis of the measurement result of the level measuring unit.
Claims15
A metal processing apparatus, comprising:
- an electrolytic bath having a reaction space and forming a liquid metal to be tapped;
- a level measuring unit for measuring a level of the liquid metal by using an electrical signal;
- a tapping unit for tapping the liquid metal;
- and
- a control unit for controlling the tapping unit on the basis of a measurement result of the level measuring unit.
2 more elements
A metal processing method, comprising:
- supplying a metal oxide and a liquid electrolyte to a reaction space of an electrolytic bath, thereby forming a liquid metal to be tapped from the metal oxide through electrowinning;
- measuring a level of the liquid metal using an electrical signal;
- and
- controlling tapping of the liquid metal based on a result of the level measurement,
- wherein only the liquid metal is selectively and intermittently tapped from the reaction space through the tapping control.
2 more elements
Dependencies are inferred from the claim text.