Laser processing apparatus, control method of laser processing apparatus, and electronic device manufacturing method

A control method of a laser processing apparatus, comprising:

• at each of step positions in a processing area changed by controlling a third actuator, selecting one of high density patterns being at least four patterns, each having a different number of rows or a different number of columns, and controlling a second actuator and a laser device to perform irradiation with the selected pattern, so that drilling is performed on a surface of a workpiece only in the processing area where drilling is required,
• the selecting and the controlling being performed by a laser processing processor, and
• the laser processing apparatus including:
• a diffractive optical element configured to divide first laser light output from the laser device into a plurality of beams of second laser light and output the second laser light;
• a light concentrating optical system configured to generate a grid-like multi-point pattern in which a plurality of light concentration spots are arranged in a row direction and a column direction by concentrating the plurality of beams of second laser light;
• a light shielding plate capable of shielding at least a part of the multi-point pattern;
• a first actuator configured to move the light shielding plate in a direction perpendicular to an optical axis of the light concentrating optical system;
• the second actuator capable of generating the high density patterns densified by moving the multi-point pattern at a movement pitch shorter than a grid interval of the multi-point pattern;
• and
• the third actuator configured to move the workpiece in the direction perpendicular to the optical axis.

An electronic device manufacturing method, comprising:

• forming a plurality of through holes in a glass substrate as a workpiece with a laser processing apparatus;
• coupling and electrically connecting an interposer and an integrated circuit chip to each other, the interposer including the glass substrate and a conductor arranged in each of the plurality of through holes;
• and
• coupling and electrically connecting the interposer and a circuit substrate to each other,
• the laser processing apparatus including:
• a diffractive optical element configured to divide first laser light output from a laser device into a plurality of beams of second laser light and output the second laser light;
• a light concentrating optical system configured to generate a grid-like multi-point pattern in which a plurality of light concentration spots are arranged in a row direction and a column direction by concentrating the plurality of beams of second laser light;
• a light shielding plate capable of shielding at least a part of the multi-point pattern;
• a first actuator configured to move the light shielding plate in a direction perpendicular to an optical axis of the light concentrating optical system;
• a second actuator capable of generating high density patterns densified by moving the multi-point pattern at a movement pitch shorter than a grid interval of the multi-point pattern;
• a third actuator configured to move a workpiece in the direction perpendicular to the optical axis;
• and
• a laser processing processor configured to, at each of step positions in a processing area changed by controlling the third actuator, select one of the high density patterns being at least four patterns, each having a different number of rows or a different number of columns, and control the second actuator and the laser device to perform irradiation with the selected pattern, so that drilling is performed on a surface of the workpiece only in the processing area where drilling is required.