Composite copper nanoparticles and method for manufacturing composite copper nanoparticles
AssigneeTaiyo Nippon Sanso Corporation
InventorsNaoya YAMAWAKI, Katsunori TAKADA, Hiroshi IGARASHI
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AssigneeTaiyo Nippon Sanso Corporation
InventorsNaoya YAMAWAKI, Katsunori TAKADA, Hiroshi IGARASHI
Estimating the term…
One object of the present application is to provide composite copper nanoparticles that have high dispersibility in organic solvents and can be used to form a smooth electrode film. The present invention provides composite copper nanoparticles in which the surfaces of copper nanoparticles are modified with a silane coupling agent, wherein the copper nanoparticles have a coating film containing copper oxide on at least a part of the surface, and wherein the mass carbon concentration derived from the silane coupling agent in the composite copper nanoparticles is 0.1 to 1.2% by mass with respect to the total mass of the composite copper nanoparticles or wherein the number of surface groups derived from the silane coupling agent on the surface of the composite copper nanoparticles is 1.0 to 13.0 per 1 nm2 of the surface area of the composite copper nanoparticles
Composite copper nanoparticles in which the surfaces of copper nanoparticles are modified with a silane coupling agent,
Composite copper nanoparticles in which the surfaces of copper nanoparticles are modified with a silane coupling agent,
A method for manufacturing composite copper nanoparticles in which the surfaces of copper nanoparticles are modified with a silane coupling agent, comprising:
Dependencies are inferred from the claim text.