Package structure
AssigneeLextar Electronics Corporation
InventorsShiou-Yi KUO, Jian-Chin LIANG
Life of this patent
Estimating the term…
Abstract
A packaging structure is provided. The packaging structure includes a dielectric layer, a redistribution layer, a plurality of light-emitting elements, a photodegradation prevention layer, and a cover layer. The redistribution layer is disposed on the dielectric layer. The plurality of light-emitting elements is disposed on the redistribution layer and electrically connected to the redistribution layer. The photodegradation prevention layer is disposed on the dielectric layer and surrounds the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the photodegradation prevention layer. The area of the photodegradation prevention layer accounts for at least 50% of the area of the cover layer.
Claims20
A packaging structure comprising:
- a dielectric layer;
- a redistribution layer disposed on the dielectric layer;
- a plurality of light-emitting elements disposed on the redistribution layer and electrically connected to the redistribution layer;
- a photodegradation prevention layer disposed on the dielectric layer and surrounding the plurality of light-emitting elements;
- and
- a cover layer disposed on the plurality of light-emitting elements and the photodegradation prevention layer,
- wherein an area of the photodegradation prevention layer accounts for at least 50% of an area of the cover layer.
A packaging structure comprising:
- a dielectric layer;
- a redistribution layer disposed on the dielectric layer;
- a plurality of light-emitting elements disposed on the redistribution layer and electrically connected to the redistribution layer;
- and
- a cover layer disposed on the plurality of light-emitting elements and the photodegradation prevention layer,
- wherein an area of the redistribution layer accounts for at least 50% of an area of the cover layer.
Dependencies are inferred from the claim text.