US 2026/0122778 A1Published application

Bendable circuit board

AssigneesHongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited., Garuda Technology Co., Ltd.

InventorCheng-Jia LI

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Abstract

A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure, and includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature.

Claims15

Dependent claims

A bendable circuit board, comprising:

a first structure, comprising:
a first insulation layer;
a first insulation extension material surrounding the first insulation layer, wherein an elongation rate of the first insulation extension material is greater than an elongation rate of the first insulation layer;
a first conductive layer comprising a first conductive feature and a second conductive feature, wherein the first conductive feature is inside the first insulation layer, and the second conductive feature is inside the first insulation extension material;
and
a first conductive extension feature extending along a horizontal direction and connecting the first conductive feature to the second conductive feature, wherein an elongation rate of the first conductive extension feature is greater than an elongation rate of the first conductive layer;
and
a second structure bonded to the first structure along a vertical direction, wherein the first structure and the second structure have a cavity therebetween, wherein the second structure comprises:
a second insulation layer;
a second insulation extension material surrounding the second insulation layer, wherein an elongation rate of the second insulation extension material is greater than an elongation rate of the second insulation layer;
a second conductive layer comprising a third conductive feature and a fourth conductive feature, wherein the third conductive feature is inside the second insulation layer, and the fourth conductive feature is inside the second insulation extension material;
and
a second conductive extension feature extending along the horizontal direction and connecting the third conductive feature to the fourth conductive feature, wherein an elongation rate of the second conductive extension feature is greater than an elongation rate of the second conductive layer.

10 more elements

A bendable circuit board, comprising:

a first structure, comprising:
a first insulation layer;
a first insulation extension material surrounding the first insulation layer, wherein an elongation rate of the first insulation extension material is greater than an elongation rate of the first insulation layer;
a first conductive layer comprising a first conductive feature and a second conductive feature, wherein the first conductive feature is inside the first insulation layer, and the second conductive feature is inside the first insulation extension material;
and
a first conductive extension feature extending along a horizontal direction, and connecting the first conductive feature to the second conductive feature, wherein an elongation rate of the first conductive extension feature is greater than an elongation rate of the first conductive layer;
and
a second structure bonded to the first structure along a vertical direction, wherein the first structure and the second structure have a cavity therebetween, wherein the second structure comprises:
a second insulation layer;
a second insulation extension material surrounding the second insulation layer, wherein an elongation rate of the second insulation extension material is greater than an elongation rate of the second insulation layer;
a second conductive layer comprising a third conductive feature and a fourth conductive feature, wherein the third conductive feature is inside the second insulation layer, and the fourth conductive feature is inside the second insulation extension material;
and
a second conductive extension feature extending along the horizontal direction, and connecting the third conductive feature to the fourth conductive feature, wherein an elongation rate of the second conductive extension feature is greater than an elongation rate of the second conductive layer;
and
a third conductive extension feature extending along the vertical direction and connecting the second conductive feature to the fourth conductive feature.

12 more elements

Dependencies are inferred from the claim text.