Substrate processing apparatus including antenna

A substrate processing apparatus comprising:

• a chamber;
• a boat inside the chamber, the boat configured to support one or more semiconductor substrates;
• first and second antennas connected to sidewalls of the chamber with the one or more semiconductor substrates interposed therebetween;
• a first signal generator configured to transmit a first microwave signal to the first antenna;
• a first rod connected to the first antenna, the first rod configured to remove a second microwave signal received by the first antenna;
• a second rod connected to the second antenna, the second rod configured to remove the first microwave signal received by the second antenna;
• and
• processing circuitry configured to control at least the first signal generator,
• wherein the one or more semiconductor substrates are heated by the first microwave signal.

A substrate processing apparatus comprising:

• a chamber;
• a boat inside the chamber, the boat configured to support one or more semiconductor substrates;
• a support configured to support the boat;
• a drive shaft configured to rotate the support and the boat in a horizontal direction;
• first and second antennas connected to sidewalls of the chamber, the first and second antennas facing each other;
• a first signal generator configured to transmit a first microwave signal to the first antenna;
• a first rod connected to the first antenna, the first rod configured to remove a second microwave signal received by the first antenna;
• a second rod connected to the second antenna, the second rod configured to remove the first microwave signal received by the second antenna;
• and
• processing circuitry configured to control at least the first signal generator,
• wherein widths of the first antenna and the second antenna increase as distances between the first antenna and the second antenna and the chamber respectively decreases.