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US 2026/0120959 A1Published application
Electrets for power electronic applications
OwnerChanyeop Parkinventor
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Abstract
Described herein are electrets and electrical components comprising electrets. Electrical components comprising electrets described herein may be incorporated into power substrates, power electronic modules, and laminated busbars.
Claims20
An electrical component comprising:
- a top conductive layer;
- a dielectric layer;
- a bottom conductive layer;
- an encapsulating material;
- and
- an electret interposed between a surface of the top conductive layer and a surface of the dielectric layer, the electret comprising:
- a silicon nitride (Si3N4) layer supported by a silicon dioxide (SiO2) layer;
- or
- a Parylene layer;
- wherein the top conductive layer, the electret, and the encapsulating material intersect at a triple point (Tp).
7 more elements
A method of manufacturing an electret, the method comprising:
- providing a substrate;
- depositing a thin film onto the substrate, the thin film comprising:
- a silicon nitride (Si3N4) layer supported by a silicon dioxide (SiO2) layer;
- or
- a Parylene layer;
- and
- triode corona charging the thin film.
4 more elements
Dependencies are inferred from the claim text.