MEMS Optical Modulator Independently Controlled with Integrated ASIC Device and Making the Same

A MEMS optical modulator with independently controlled with integrated ASIC (Application Specific Integrated Circuit) device comprising:

• a. a micromirror array device wherein the micromirrors in the micromirrors array device are arranged to form a MEMS (Micro-Electro Mechanical System) spatial light modulator, wherein each said micromirror is controlled individually and independently and each said micromirror has multiple degrees of freedom motion for spatial light modulation;
• b. a plurality of actuators for the micromirror array device wherein each said micromirror has the multiple actuators for multiple degrees of freedom motion;
• c. a substrate for the micromirror array device based on MEMS technology wherein the actuators and the micromirrors in the micromirror array device are fabricated on the substrate for the micromirror array device and wherein the substrate of the micromirror array device has a plurality of connecting means through the substrate of the micromirror array device from the one side of the substrate to the other side of the substrate;
• d. a plurality of MEMS electrodes wherein the plurality of the MEMS electrodes has correspondence with the plurality of the actuators and the plurality of the MEMS electrodes are arranged on one side of the substrate of the micromirror array device to control the plurality of the actuators in the micromirror array device;
• e. an ASIC device with a plurality of ASIC electrodes connected to the MEMS electrodes through the connecting means wherein the ASIC device is bonded with the micromirror array device in wafer-level while fabricating, wherein control voltages of the each ASIC electrodes in the ASIC device are generated independently in the ASIC device;
• and
• f. a plurality of electrical pad connections for powering and controlling the ASIC device and controlling the micromirrors in the micromirror array device;
• wherein the ASIC device and the micromirror array device is bonded with wafer-bonding technology while fabricated where the ASIC electrodes from the ASIC device and the MEMS electrodes in the micromirror array device are connected through the connecting means and control voltages of the ASIC device are transferred to the MEMS electrodes independently.