Method and apparatus for processing workpiece by using laser
AssigneeORC Manufacturing Co., Ltd.
InventorsMasahiko FUNAYAMA, Masaru YAMAGA
Life of this patent
Estimating the term…
Abstract
A method for processing a workpiece by laser ablation, which includes: a) preparing a mask with a plurality of mask patterns, the plurality of mask patterns having widths corresponding to a sub-scanning direction, the widths being different from one another; b) scanning a line-shaped laser beam over said mask; c) projecting a pattern beam that passes through the mask onto a workpiece; and d) processing a processing area of the workpiece by using the plurality of mask patterns repeatedly to form a processed pattern at the bottom of the processing area.
Claims11
A method for processing a workpiece by laser ablation, comprising:
- a) preparing a mask with a plurality of mask patterns, the plurality of mask patterns having widths corresponding to a sub-scanning direction, the widths being different from one another;
- b) scanning a line-shaped laser beam over said mask;
- c) projecting a pattern beam that passes through said mask onto a workpiece;
- and
- d) processing a processing area in said workpiece repeatedly by using said plurality of mask patterns to form a processed pattern with a flat bottom in the processing area.
A mask comprising:
- a rectangular first mask pattern;
- and
- a rectangular second mask pattern, said first mask pattern and said second mask pattern being aligned in a predetermined direction, the length of said second mask pattern being equal to that of said first mask pattern in the predetermined direction, the width of said second mask pattern being different from that of said first mask pattern in a direction perpendicular to said predetermined direction, the width of said second mask pattern being narrower than that of said first mask pattern by a length corresponding to a ringing appearing in a pattern beam that passes through said mask.
An apparatus for processing a workpiece by laser ablation, comprising:
- a light source;
- an illumination optical unit configured to form a line-shaped laser beam oscillated from said light source;
- a mask stage configured to support said mask and move said mask along a main scanning direction and a sub-scanning direction, said mask comprising a rectangular first mask pattern and a rectangular second mask pattern;
- a scanner configured to scan the line-shaped laser beam over said mask;
- a projection optical system configured to project a pattern beam that passes through said mask onto said workpiece;
- a processing stage configured to move said workpiece along the main scanning direction and the sub-scanning direction;
- and
- a controller configured to control said light source, said scanner, said mask stage and said processing stage, the width of said second mask pattern being narrower than that of said first mask pattern by a length corresponding to a ringing appearing in the pattern beam, said controller carrying out a laser ablation in a processing area of said workpiece repeatedly to form a processed pattern with a flat bottom in the processing area by controlling said mask stage and said processing stage.
A method for processing a workpiece by laser ablation, comprising:
- a) preparing a mask with a plurality of mask patterns, said plurality of mask patterns having widths between pattern edges intersecting a direction corresponding to a sub-scanning direction, the widths of said plurality of mask patterns being different from one another, said plurality of mask patterns being geometrically similar to one another;
- b) scanning a line-shaped laser beam over said mask;
- c) projecting a pattern beam that passes through said mask onto a workpiece;
- and
- d) processing a processing area of said workpiece by using said plurality of mask patterns repeatedly to form a processed pattern with a flat bottom the processing area.
Dependencies are inferred from the claim text.