Substrate processing module and substrate processing method

A substrate processing method, performing a first process and a second process after the first process on a substrate, the substrate processing method comprising:

• carrying the substrate into a substrate processing module through a carry-in port;
• holding the substrate by using a substrate holding part;
• swinging a first nozzle arm in a direction parallel to a substrate holding surface of the substrate holding part by using a first swing mechanism while supplying a first fluid from a first nozzle supported by the first nozzle arm to the substrate to perform the first process on the substrate;
• swinging a second nozzle arm in a direction parallel to the substrate holding surface by using a second swing mechanism while supplying a second fluid from a second nozzle supported by the second nozzle arm to the substrate to perform the second process on the substrate;
• and
• carrying out the substrate from the substrate processing module through a carry-out port,
• wherein the carry-in port and the carry-out port are arranged symmetrically with respect to a reference line when viewed from top of the substrate processing module, and the reference line is a line that passes through the substrate holding surface when viewed from the top of the substrate processing module and extends parallel to the substrate holding surface,
• a first swing shaft of the first swing mechanism is arranged adjacent to the carry-in port, and
• a second swing shaft of the second swing mechanism is arranged adjacent to the carry-out port.