Systems and methods for semiconductor packaging using printed circuit board (pcb) cavity integration

An apparatus comprising:

• a substrate comprising a first side and a second side, the first side being opposite the second side;
• a first circuit coupled to the first side, the first circuit being characterized by a first thickness;
• and
• a second circuit coupled to the second side, the second circuit comprising a radio frequency (RF) component, the second circuit being characterized by a second thickness, the second thickness being greater than the first thickness;
• wherein the second thickness is greater than or equal to 80 um.

An apparatus comprising:

• a substrate comprising a first side and a second side, the first side being opposite the second side, and the second side comprising a first cavity;
• a first circuit coupled to the first side, the first circuit being characterized by a first thickness;
• and
• a second circuit positioned within the first cavity, the second circuit comprises a radio frequency (RF) component, the second circuit being characterized by a second thickness, the second thickness being greater than the first thickness;
• wherein the first cavity is characterized by a first depth greater than or equal to 20 um.