Bonding a terahertz imager to a lens to provide an optimal interface
AssigneeTihive
InventorsVictoria NASSERDDINE, Hani SHERRY, Carlos PRADA ROJAS
Life of this patent
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Abstract
The invention relates to a method for assembling an optical device compatible with terahertz radiation, comprising the following steps: providing first and second silicon elements each having a planar face; depositing on the planar face of the first element an adhesive having the following characteristics: a) epoxy resin curable by heat, b) Brookfield viscosity CP51, 25° C., speed 5 rpm: 50000 mPa·s±20%, and c) absence of fillers to make the adhesive electrically or thermally conductive; and applying the planar face of the second element to the adhesive deposited on the planar face of the first element.
Claims2
A method for assembling an optical device compatible with terahertz radiation, comprising the following steps:
- providing a silicon lens (12) and a silicon chip including terahertz components (18), each having a planar face;
- depositing on the planar face of the lens or of the chip an adhesive having the following characteristics:
- epoxy resin curable by heat,
- Brookfield viscosity CP51, 25° C., speed 5 rpm:
- 50000 mPa·s±20%, and
- absence of fillers to make the adhesive electrically or thermally conductive;
- and
- applying the planar face of the chip to the planar face of the lens.
Dependencies are inferred from the claim text.