Resin composition and article made therefrom

Abstract

The present disclosure provides a resin composition comprising: a component (A): 100 parts by weight of polyphenylene ether resin containing unsaturated carbon-carbon double bonds; a component (B): 1 to 20 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; and a component (C): 5 to 100 parts by weight of benzocyclobutene-modified second polyolefin. Besides, the present disclosure also provides an article made from the resin composition. The article comprises a prepreg, a resin film, a laminate or a printed circuit board that has improvements in one or more properties including stability of peeling strength of bonding sheet and core, solder ball shear, bonding gap and solder floating delamination rate.

Dependencies are inferred from the claim text.