Resin composition, cured layer, manufacturing method of cured layer and etching method

Abstract

A resin composition, a cured layer, a manufacturing method of a cured layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B) and a solvent (C). The resin (A) includes a structure represented by the following Formula (A-1). The crosslinking agent (B) includes a polymer including a first structural unit represented by the following Formula (B-1) and a second structural unit represented by the following Formula (B-2). Based on a usage amount of the resin (A) being 100 parts by weight, a usage amount of the crosslinking agent (B) is 60 parts by weight to 150 parts by weight, and a usage amount of the solvent (C) is 2400 parts by weight to 99900 parts by weight. In Formula (A-1), Formula (B-1) and Formula (B-2), the definition of each substituent is the same as defined in the specification.

Dependencies are inferred from the claim text.