Thermosetting resin composition and a semiconductor device

Abstract

One of the purposes of the present invention is to provide a thermosetting resin composition with excellent adhesion to metals. A thermosetting resin composition, comprising the following components (A) to (D): (A) a thermosetting resin; (B) a silane coupling agent represented by the following formula (I): wherein, in formula (I), R1 is, independently of each other, an alkyl group having 1 to 8 carbon atoms, m is an integer of 1 to 3, n is an integer of 0 to 10, Q is a single bond or an amide bond (—NHCO—), A is a nitrogen-containing heterocyclic group having at least two nitrogen atoms, wherein one of the nitrogen atoms is bonded to the carbon atom of —(CH2)n— or of —NHCO—; (C) a curing accelerator; and (D) an inorganic filler.

Dependencies are inferred from the claim text.