Porosity-free phenolic epoxies

Abstract

A porosity-free phenolic epoxy to use as a fill for nanostructures, the phenolic epoxy including i) poly(tetrahydrofuran); ii) polyglycidyl ether of phenol-formaldehyde; iii) ethyl methyl ketone; and iv) a solvent such as isopropanol. The phenolic epoxy creates a uniform, void free fill that improves silicon wafer processing, metrology, and TEM analysis. A method to fill a nanostructure with a porosity-free phenolic epoxy, includes placing tetrahydrofuran in a strong acid such that a ring of the tetrahydrofuran is opened to create a tetrahydrofuran monomer, polymerizing the tetrahydrofuran monomer to create poly(tetrahydrofuran), mixing the poly(tetrahydrofuran) with polyglycidyl ether of phenol-formaldehyde, ethyl methyl ketone, and isopropanol, and depositing one or more layers of the porosity-free phenolic epoxy onto a surface of a nanostructure.

Dependencies are inferred from the claim text.