Compression resin sealing molding device

A compression resin sealing molding device for molding a sealing resin layer on a substrate to a predetermined final thickness, the substrate having a first surface and a second surface opposite each other, the device comprising:

• a lower mold facing the first surface;
• and
• an upper mold configured to abut the second surface, wherein the lower mold includes
• an outer frame and an inner frame, the inner frame including an inner frame first portion and an inner frame second portion;
• the outer frame being configured to abut the upper mold outside the substrate to establish a fixed final thickness;
• the inner frame being configured to pressurize a resin material in a first state;
• and
• the inner frame second portion being vertically displaceable independent of the inner frame first portion to create a localized leakage path for excess resin material in a second state, the second state being achieved when the outer frame abuts the upper mold.

A method of compression resin sealing a substrate to a predetermined thickness, comprising:

• (a) placing a resin material and the substrate into a lower mold having an outer frame and an inner frame that are vertically displaceable relative to one another;
• (b) bringing an upper mold and the lower mold together to confine and pressurize the resin material in a first state;
• (c) continuing the movement of the lower mold and the upper mold relative to one another until the outer frame abuts the upper mold, thereby establishing the predetermined thickness, and simultaneously displacing the inner frame to intentionally leak excess resin material into an overflow region to achieve a second state;
• and
• (d) hardening the resin material in the second state.