# US 2026/0109082 A1 · Method of manufacturing wafer cleaning brush > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0109082 A1 - Document ID: US20260109082A1 - Status: Published application - Kind: A1 - Application number: 19/315,945 - Filed: 2025-09-02 - Published: 2026-04-23 - Earliest claimed: 2024-10-21 - Assignees: Samsung Electronics Co., Ltd.; Korea Advanced Institute of Science and Technology - Applicants: Samsung Electronics Co., Ltd. - Inventors: Dongchan Kim; Sanha Kim; Somin Shin; Byoungho Kwon - Web page: https://patentgrep.com/patent/US20260109082A1 ## CPC - B29B 7/002: {Methods (chemical aspects C08J3/00)} - B29C 71/0009: {using liquids, e.g. solvents, swelling agents (spectacle cases, e.g. for cleaning contact lenses A45C11/04; disinfecting or sterilising contact lenses A61L12/00, using liquid substances A61L2/20; cleaning involving the use of liquid in general B08B3/00; for hydrating contact lenses B29D11/00067)} - C08J 3/005: {Processes for mixing polymers} - B29K 2027/14: {PVF, i.e. polyvinyl fluoride} - B29K 2029/04: {PVOH, i.e. polyvinyl alcohol (B29K2031/04 takes precedence)} - B29L 2031/42: Brushes - B29B: PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract Provided is a method of manufacturing a brush, such as a wafer cleaning brush. The method includes providing a polyvinyl alcohol (PVA) solution, forming an insoluble polyvinyl fluoride (PVF) by adding formaldehyde to the PVA solution, adding a water-soluble inorganic compound including a plurality of particles to the insoluble PVF, and mixing the insoluble PVF with the water-soluble inorganic compound to form a mixture of the water-soluble inorganic compound and the insoluble PVF, forming a brush by inserting the mixture of the water-soluble inorganic compound and the insoluble PVF into a mold and heat-treating the mixture, removing the wafer cleaning brush from the mold; and washing the wafer cleaning brush to remove the plurality of particles of the water-soluble inorganic compound from the wafer cleaning brush. ## Claims ### Claim 1 A method of manufacturing a wafer cleaning brush, the method comprising: providing a polyvinyl alcohol (PVA) solution; forming an insoluble polyvinyl fluoride (PVF) by adding formaldehyde to the PVA solution; adding a water-soluble inorganic compound comprising a plurality of particles to the insoluble PVF, and mixing the insoluble PVF with the water-soluble inorganic compound to form a mixture of the water-soluble inorganic compound and the insoluble PVF; forming a wafer cleaning brush by inserting the mixture of the water-soluble inorganic compound and the insoluble PVF into a mold and heat-treating the mixture; removing the wafer cleaning brush from the mold; and washing the wafer cleaning brush to remove the plurality of particles of the water-soluble inorganic compound from the wafer cleaning brush. ### Claim 2 (depends on 1) The method of claim 1, wherein the water-soluble inorganic compound comprises at least one compound selected from the group consisting of NaCl, CaCO3, and MgSO4. ### Claim 3 (depends on 1) The method of claim 1, wherein a plurality of pores are formed in the wafer cleaning brush in a plurality of spaces from which the plurality of particles of the water-soluble inorganic compound are removed, and a mean pore diameter of the pores is a diameter from 1 μm to 100 μm. ### Claim 4 (depends on 1) The method of claim 1, wherein a plurality of pores are formed in the wafer cleaning brush in a plurality of spaces from which the plurality of particles of the water-soluble inorganic compound are removed, and wherein a mean pore diameter of the plurality of pores is determined based on a diameter of the water-soluble inorganic compound. ### Claim 5 (depends on 1) The method of claim 1, wherein a porosity of the wafer cleaning brush is controlled by controlling a weight of the water-soluble inorganic compound added to the insoluble PVF. ### Claim 6 (depends on 1) The method of claim 1, further comprising adding a surfactant after forming the insoluble PVF and before adding a water-soluble inorganic compound to the insoluble PVF. ### Claim 7 (depends on 6) The method of claim 6, wherein the surfactant comprises oxyphenol ethoxylate. ### Claim 8 (depends on 1) The method of claim 1, wherein the forming of the insoluble PVF is performed by crosslinking using a catalyst. ### Claim 9 (depends on 8) The method of claim 8, wherein a formation rate of the insoluble PVF is adjusted by adjusting a weight of the catalyst. ### Claim 10 A method of manufacturing a wafer cleaning brush, the method comprising: providing a polyvinyl alcohol (PVA) solution; adding a water-soluble inorganic compound comprising a plurality of particles and an acetone-based material to the PVA solution, and mixing the PVA solution, the water-soluble inorganic compound, and the acetone-based material to form a mixture of the PVA solution, the water-soluble inorganic compound, and the acetone-based material; adding formaldehyde to the mixture of the PVA solution, the water-soluble inorganic compound, and the acetone-based material to form an insoluble polyvinyl fluoride (PVF) and to form a mixture of the water-soluble inorganic compound, the acetone-based material and the insoluble PVF; forming a wafer cleaning brush by inserting the mixture of the water-soluble inorganic compound, the acetone-based material, and the insoluble PVF into a mold, and heat-treating the mixture; removing the wafer cleaning brush from the mold; and washing the wafer cleaning brush to remove the plurality of particles of the water-soluble inorganic compound from the wafer cleaning brush. ### Claim 11 (depends on 10) The method of claim 10, wherein the water-soluble inorganic compound comprises at least one compound selected from the group consisting of NaCl, CaCO3, and MgSO4. ### Claim 12 (depends on 10) The method of claim 10, wherein a plurality of pores are formed in the wafer cleaning brush in a plurality of spaces from which the plurality of particles of the water-soluble inorganic compound are removed, and a mean pore diameter of the pores is a diameter from 1 μm to 100 μm. ### Claim 13 (depends on 10) The method of claim 10, wherein a plurality of pores are formed in the wafer cleaning brush in a plurality of spaces from which the plurality of particles of the water-soluble inorganic compound are removed, and wherein a mean pore diameter of the plurality of pores is determined based on a diameter of the water-soluble inorganic compound. ### Claim 14 (depends on 10) The method of claim 10, wherein a porosity of the wafer cleaning brush is determined based on a weight of the water-soluble inorganic compound added to the insoluble PVF. ### Claim 15 (depends on 10) The method of claim 10, wherein the forming of the insoluble PVF is performed by crosslinking using a catalyst. ### Claim 16 (depends on 15) The method of claim 15, wherein a formation rate of the insoluble PVF is determined based on a weight of the catalyst. ### Claim 17 A method of manufacturing a wafer cleaning brush, the method comprising: providing a polyvinyl alcohol (PVA) solution; forming an insoluble polyvinyl fluoride (PVF) by adding formaldehyde and a catalyst to the PVA solution and crosslinking the PVA solution with the formaldehyde by the catalyst; adding a water-soluble inorganic compound comprising a plurality of particles to the insoluble PVF and mixing the insoluble PVF with the water-soluble inorganic compound to disperse the water-soluble inorganic compound in the insoluble PVF; forming a wafer cleaning brush by inserting a mixture of the water-soluble inorganic compound and the insoluble PVF into a mold and heat-treating the mixture; removing the wafer cleaning brush from the mold; and forming a plurality of pores by washing the wafer cleaning brush to remove the plurality of particles of the water-soluble inorganic compound from the wafer cleaning brush. ### Claim 18 (depends on 17) The method of claim 17, wherein the water-soluble inorganic compound comprises at least one compound selected from the group consisting of NaCl, CaCO3, and MgSO4. ### Claim 19 (depends on 17) The method of claim 17, wherein a mean pore diameter of the plurality of pores is from 1 μm to 100 μm. ### Claim 20 (depends on 18) The method of claim 18, wherein a mean pore diameter of the plurality of pores is determined based on a mean diameter of the water-soluble inorganic compound, and a porosity of the wafer cleaning brush is determined based on a weight of the water-soluble inorganic compound added to the insoluble PVF.