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US 2026/0107847 A1Published application
Double-sided integrated circuit module having an exposed semiconductor die
AssigneeQorvo US, Inc.
InventorsJohn Robert Siomkos, Edward T. Spears, Mark Alan Crandall
Life of this patent
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Abstract
The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.
Claims20
A radio frequency (RF) module, comprising:
- a module substrate defining a top side and a bottom side;
- an electronic component configured for RF operation, the electronic component being coupled to the top side of the module substrate;
- a first mold compound that encapsulates the electronic component;
- a semiconductor die coupled to the bottom side of the module substrate, wherein the semiconductor die includes a plurality of conductive elements coupled between the semiconductor die and the bottom side of the module substrate;
- a plurality of solder balls attached at the bottom side of the module substrate;
- and
- a second mold compound encapsulating the semiconductor die and the plurality of solder balls such that the second mold compound at least partially surrounds the semiconductor die, wherein a surface of the semiconductor die is exposed through an opening in the second mold compound, wherein each of the plurality of solder balls extends from the bottom side of the module substrate to below the surface of the semiconductor die, and the second mold compound defines a planar bottom module surface and the surface of the semiconductor die.
4 more elements
A radio frequency (RF) module, comprising:
- a module substrate defining a top side and a bottom side;
- an electronic component configured for RF operation, the electronic component being coupled to the top side of the module substrate;
- a first mold compound that encapsulates the electronic component;
- a semiconductor die coupled to the bottom side of the module substrate, wherein the semiconductor die includes a plurality of conductive elements coupled between the semiconductor die and the bottom side of the module substrate;
- a plurality of solder balls attached at the bottom side of the module substrate;
- a second mold compound encapsulating the semiconductor die and the plurality of solder balls such that the second mold compound at least partially surrounds the semiconductor die, wherein a surface of the semiconductor die is exposed through an opening in the second mold compound, wherein each of the plurality of solder balls extends from the bottom side of the module substrate to below the surface of the semiconductor die, and the second mold compound defines a planar bottom module surface and the surface of the semiconductor die;
- and
- a heat exchanger coupled to the planar bottom module surface such that the heat exchanger is configured to exchange heat with the semiconductor die.
5 more elements
A radio frequency (RF) module, comprising:
- a module substrate defining a top side and a bottom side;
- an electronic component configured for RF operation, the electronic component being coupled to the top side of the module substrate;
- a first mold compound that encapsulates the electronic component;
- a semiconductor die coupled to the bottom side of the module substrate, wherein the semiconductor die includes a plurality of conductive elements coupled between the semiconductor die and the bottom side of the module substrate;
- a plurality of module contacts attached at the bottom side of the module substrate;
- a second mold compound encapsulating the semiconductor die and the plurality of module contacts such that the second mold compound at least partially surrounds the semiconductor die, wherein a surface of the semiconductor die is exposed from the second mold compound;
- and
- a sensor substrate attached to the surface of the semiconductor die that is exposed from the second mold compound.
5 more elements
Dependencies are inferred from the claim text.