Grinding method and ground wafer manufacturing method

A ground wafer manufacturing method for manufacturing a ground wafer by use of a grinding method for grinding a workpiece by use of a grinding apparatus,

• the grinding apparatus including a holding table that has a holding surface of a conical surface shape and is rotatable about an axis intersecting the holding surface, a grinding unit that includes a spindle to which grindstones are attached and grinds the workpiece held on the holding surface of the holding table by bringing the grindstones into contact with the workpiece while causing the grindstones to rotate in such a manner as to form a grinding surface lying along the holding surface, and a moving unit that moves the holding table and the grindstones relative to each other,
• the grinding method including
• holding the workpiece on the holding surface of the holding table,
• grinding the workpiece held on the holding surface by performing grinding feed in which the moving unit causes the holding table and the spindle to approach each other in directions along a rotational axis of the spindle in a state in which the workpiece and the grindstones are in contact with each other while the holding table and the spindle are independently being rotated with respective rotational axes extending along each other, and,
• after the grinding the workpiece, stopping the grinding feed by the moving unit and moving the holding table and the spindle relative to each other in directions intersecting the rotational axis of the spindle while rotating the holding table and the spindle,
• wherein the workpiece is a platelike wafer.