# US 2026/0107720 A1 · Substrate trimming apparatus and substrate processing equipment including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0107720 A1 - Document ID: US20260107720A1 - Status: Published application - Kind: A1 - Application number: 19/347,865 - Filed: 2025-10-02 - Published: 2026-04-16 - Earliest claimed: 2024-10-10 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Heejung KIM; Jaeho HONG - Web page: https://patentgrep.com/patent/US20260107720A1 ## CPC - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 72/0408: {for drying} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring} - H10P 72/53: {using optical controlling means} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate trimming apparatus includes a support configured to support a bonding substrate including at least two substrates bonded to each other, a waterjet cutting unit arranged to face an upper surface of the support and configured to trim an edge area of the bonding substrate by discharging pressurized fluid, and a camera unit configured to sense the trimmed edge area of the bonding substrate, in which the waterjet cutting unit includes a water body through which ultrapure water passes, a mixing tube coupled to a lower portion of the water body, and an abrasive supplying unit configured to supply an abrasive, and the waterjet cutting unit is configured to discharge at least one of the ultrapure water or a mixture of the ultrapure water and the abrasive towards the edge area of the bonding substrate. ## Claims ### Claim 1 A substrate trimming apparatus comprising: a support configured to support a bonding substrate including at least two substrates bonded to each other; a waterjet cutting unit arranged to face an upper surface of the support and configured to trim an edge area of the bonding substrate by discharging pressurized fluid; and a camera unit configured to sense the trimmed edge area of the bonding substrate, wherein the waterjet cutting unit includes a water body through which ultrapure water passes, a mixing tube coupled to a lower portion of the water body, and an abrasive supplying unit configured to supply an abrasive, and the waterjet cutting unit is configured to discharge at least one of the ultrapure water or a mixture of the ultrapure water and the abrasive towards the edge area of the bonding substrate. ### Claim 2 (depends on 1) The substrate trimming apparatus of claim 1, wherein a pressure of the fluid is in a range from about 4,100 bar to about 6,400 bar. ### Claim 3 (depends on 1) The substrate trimming apparatus of claim 1, wherein the waterjet cutting unit further includes a position adjusting unit configured to: move the waterjet cutting unit in at least one direction of a first horizontal direction, a second horizontal direction, or a vertical direction different from the first and second horizontal directions, and tilt the waterjet cutting unit to form a certain angle from a Z axis of the waterjet cutting unit. ### Claim 4 (depends on 1) The substrate trimming apparatus of claim 1, further comprising a suction configured to suck residues generated from the bonding substrate. ### Claim 5 (depends on 1) The substrate trimming apparatus of claim 1, further comprising a controller configured to control a position of the waterjet cutting unit, a pressure of the fluid, and a type of the fluid based on parameters of the bonding substrate, which are measured by the camera unit. ### Claim 6 (depends on 5) The substrate trimming apparatus of claim 5, wherein the parameters include at least one of a trimming degree of the bonding substrate, a trimming speed of the bonding substrate, or a type of a trimmed layer of the bonding substrate. ### Claim 7 (depends on 1) The substrate trimming apparatus of claim 1, wherein the support is configured to rotate around a Z axis of the support. ### Claim 8 (depends on 1) The substrate trimming apparatus of claim 1, wherein the bonding substrate includes a first substrate and a second substrate, and at least one of the first substrate or the second substrate includes at least two layers having different hardnesses from each other. ### Claim 9 (depends on 1) The substrate trimming apparatus of claim 1, wherein the bonding substrate includes a first substrate, a second substrate, and a third substrate, and at least some of the first substrate, the second substrate, and the third substrate have different material properties from each other. ### Claim 10 (depends on 1) The substrate trimming apparatus of claim 1, wherein the waterjet cutting unit further includes an orifice, an abrasive supply line, an abrasive body, and an abrasive auxiliary port. ### Claim 11 A substrate processing equipment comprising: an index module configured to receive and store a bonding substrate from outside; and a processing module configured to process the bonding substrate received from the index module, wherein the processing module includes: a substrate aligning apparatus configured to align the bonding substrate before trimming the bonding substrate; a substrate trimming apparatus configured to trim an edge area of the aligned bonding substrate; a substrate cleaning apparatus configured to clean the trimmed bonding substrate; a substrate drying apparatus configured to dry the cleaned bonding substrate; and a transfer robot configured to transfer the bonding substrate from a station to another among the substrate aligning apparatus, the substrate trimming apparatus, the substrate cleaning apparatus, and the substrate drying apparatus, and the substrate trimming apparatus includes: a support configured to support the bonding substrate; a waterjet cutting unit arranged to face an upper surface of the support and configured to trim the edge area of the bonding substrate by discharging pressurized fluid; a camera unit configured to sense the trimmed edge area of the bonding substrate; and a suction configured to suck residues generated from the bonding substrate. ### Claim 12 (depends on 11) The substrate processing equipment of claim 11, wherein the waterjet cutting unit includes a water body through which ultrapure water passes, an abrasive supplying unit configured to supply an abrasive, an abrasive body storing the abrasive received from the abrasive supplying unit, an orifice through which the ultrapure water passes, and a mixing tube in which the ultrapure water and the abrasive are mixed. ### Claim 13 (depends on 11) The substrate processing equipment of claim 11, wherein the substrate aligning apparatus, the substrate trimming apparatus, the substrate cleaning apparatus, and the substrate drying apparatus are aligned in a 2X2 arrangement. ### Claim 14 (depends on 11) The substrate processing equipment of claim 11, wherein the suction includes a suction nozzle, a suction flow path, a dust collector, and a suction pump. ### Claim 15 (depends on 11) The substrate processing equipment of claim 11, further comprising a controller configured to control a position of the waterjet cutting unit, a pressure of the fluid, and a type of the fluid based on parameters of the bonding substrate, which are measured by the camera unit, wherein the parameters include at least one of a trimming degree of the bonding substrate, a trimming speed of the bonding substrate, or a type of a trimmed layer of the bonding substrate. ### Claim 16 (depends on 11) The substrate processing equipment of claim 11, wherein the bonding substrate includes a first substrate and a second substrate, and at least one of the first substrate or the second substrate includes at least two layers having different hardnesses from each other. ### Claim 17 (depends on 11) The substrate processing equipment of claim 11, wherein the bonding substrate includes a first substrate, a second substrate, and a third substrate, and at least some of the first substrate, the second substrate, and the third substrate have different material properties from each other. ### Claim 18 A substrate processing equipment comprising: an index module including a load chamber storing a bonding substrate received from the outside and a first transfer robot configured to transfer the bonding substrate from the load chamber to a processing module; and the processing module configured to process the bonding substrate received from the index module, wherein the processing module includes: a substrate aligning apparatus configured to align the bonding substrate before trimming the bonding substrate and including a stage and a camera; a substrate trimming apparatus configured to trim an edge area of the aligned bonding substrate; a substrate cleaning apparatus configured to clean the trimmed bonding substrate; a substrate drying apparatus configured to dry the cleaned bonding substrate; and a second transfer robot configured to transfer the bonding substrate from a station to another among the substrate aligning apparatus, the substrate trimming apparatus, the substrate cleaning apparatus, and the substrate drying apparatus, the substrate trimming apparatus includes: a support configured to support the bonding substrate; a waterjet cutting unit arranged to face an upper surface of the support and configured to trim the edge area of the bonding substrate by discharging pressurized fluid; a camera unit configured to sense the trimmed edge area of the bonding substrate; a suction configured to suck residues generated from the bonding substrate; and a controller configured to control a position of the waterjet cutting unit, a pressure of the fluid, a type of the fluid, and an operation of the suction based on parameters of the bonding substrate, which are measured by the camera unit, and the waterjet cutting unit includes a water body through which ultrapure water passes, an abrasive supplying unit configured to supply an abrasive, an abrasive body storing the abrasive received from the abrasive supplying unit, an orifice through which the ultrapure water passes, a mixing tube in which the ultrapure water and the abrasive are mixed, and a position adjusting unit configured to adjust at least one of a position or an angle of the fluid to be discharged. ### Claim 19 (depends on 18) The substrate processing equipment of claim 18, wherein the bonding substrate includes a first substrate and a second substrate, and at least one of the first substrate or the second substrate includes at least two layers having different hardnesses from each other. ### Claim 20 (depends on 18) The substrate processing equipment of claim 18, wherein the pressure of the fluid is in a range from about 4,100 bar to about 6,400 bar.