Pick-and-place apparatus with force measurement
AssigneeNexperia B.V.
InventorsYazhao LIU, Johannes Frans Lodewijk Goosen, Gijs Van Der Veen
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Abstract
According to an aspect of the present disclosure, a pick-and-place apparatus is provided for picking an electronic component from a first carrier and for placing the electronic component onto a second carrier. The apparatus includes a pickup unit that is provided with a diffraction grating that includes a repetition, in a first direction, of a pattern unit. By impinging collimated light onto the diffraction grating, an n-th order light beam is generated. A change in length of the pickup unit in the first direction at a position of the diffraction grating can be determined based on the sensed n-th order light beam.
Claims18
A pick-and-place apparatus for picking an electronic component from a first carrier and for placing the electronic component onto a second carrier, the apparatus comprising:
- a pickup unit for picking an electronic component and a pickup unit for placing the electronic component, wherein the pickup unit(s) have an outer surface that is provided with a diffraction grating that comprises a repetition, in a first direction, of a pattern unit;
- at least one collimated light source configured to emit collimated light onto the diffraction grating when picking an electronic component from the first carrier and/or when placing an electronic component onto the second carrier;
- a sensor system to sense an n-th order light beam from the diffraction grating, wherein |n|>0;
- and
- a processor configured to determine a change in length of the pickup unit in the first direction at a position of the diffraction grating based on the sensed n-th order light beam when picking an electronic component from the first carrier and/or when placing an electronic component onto the second carrier.
A method for picking an electronic component from a first carrier, comprising the steps:
- picking, using a pickup unit, an electronic component from the first carrier, wherein the pickup unit has an outer surface that is provided with a diffraction grating that comprises a repetition, in a first direction, of a pattern unit;
- emitting collimated light onto the diffraction grating when picking an electronic component from the first carrier;
- sensing an n-th order light beam from the diffraction grating, wherein |n|>0;
- and
- determining a change in length of the pickup unit in the first direction at a position of the diffraction grating based on the sensed n-th order light beam when picking the electronic component from the first carrier.
A method for placing an electronic component from a second carrier, comprising the steps of:
- placing, using a pickup unit, an electronic component from the second carrier, wherein the pickup unit has an outer surface that is provided with a diffraction grating that comprises a repetition, in a first direction, of a pattern unit;
- emitting collimated light onto the diffraction grating when placing an electronic component onto the second carrier;
- sensing an n-th order light beam from the diffraction grating, wherein |n|>0;
- and
- determining a change in length of the pickup unit in the first direction at a position of the diffraction grating based on the sensed n-th order light beam when placing the electronic component onto the second carrier.
Dependencies are inferred from the claim text.