Multilayer ceramic capacitor and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSun-Min Jung, Sangkyu Lee, Hongseok Kim, Chanhee Nam
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Abstract
A multilayer ceramic capacitor including a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer surface of the capacitor body, wherein the dielectric layer includes barium (Ba), titanium (Ti), and boron (B), the dielectric layer includes a plurality of dielectric grains and grain boundaries disposed between the plurality of dielectric grains, and an average thickness of the grain boundaries is about 1 nm to about 10 nm.
Claims20
A multilayer ceramic capacitor, comprising
- a capacitor body including a dielectric layer and an internal electrode layer, and
- an external electrode disposed on an outer surface of the capacitor body,
- wherein the dielectric layer includes barium (Ba), titanium (Ti), and boron (B),
- the dielectric layer includes a plurality of dielectric grains and a grain boundary disposed between adjacent dielectric grains among the plurality of dielectric grains, and
- an average thickness of the grain boundary is 1 nm to 10 nm.
A method of manufacturing a multilayer ceramic capacitor, comprising
- mixing a barium titanate-based compound and borosilicate glass to prepare a dielectric slurry;
- manufacturing a plurality of dielectric green sheets from the dielectric slurry and forming a conductive paste layer on a surface of two or more dielectric green sheets among the plurality of dielectric green sheets;
- manufacturing a dielectric green sheet stack by stacking the plurality of the dielectric green sheets including the two or more dielectric green sheets on which the conductive paste layer is formed;
- firing the dielectric green sheet stack to manufacture a capacitor body including a dielectric layer and an internal electrode layer;
- and
- forming an external electrode on a surface of the capacitor body,
- wherein the dielectric layer includes barium (Ba), titanium (Ti), and boron (B),
- the dielectric layer includes a plurality of dielectric grains and a grain boundary disposed between adjacent dielectric grains among the plurality of dielectric grains, and an average thickness of the grain boundary is 1 nm to 10 nm.
Dependencies are inferred from the claim text.