Lead Forming Device for Forming an Electronic Component Lead and a Method for Forming an Electronic Component Lead

A lead forming device for forming an electronic component lead, comprising:

• two cooperating opposite tool parts relatively movable towards and away from each other;
• a first clamp half attached to one of the tool parts and a second clamp half attached to the opposite tool part for clamping at least part of the lead;
• at least one first forming punch movably connected to one of the tool parts and at least one second forming punch movably connected to the opposite tool part;
• and
• a drive arranged for independently controlling cooperative movement of the first and second forming punches,
• wherein the at least one first forming punch and the at least one second forming punch are configured to consecutively bend the electronic component lead while the lead remains clamped by the first clamp half and the second clamp half.