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US 2026/0104798 A1Published application
Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages
OwnerDavid LAZOVSKY, Philip WINTERBOTTOM +1inventors
InventorsDavid LAZOVSKY, Philip WINTERBOTTOM, Martinus BOS
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Abstract
Multi-chip electro-photonic networks for interconnecting multiple circuit packages via photonic channels. Examples of a computing system include a first circuit package, a second circuit package, and one or more inter-chip bidirectional photonic channels interconnecting the first and second circuit packages. The first circuit package can include one or more memory nodes. The second circuit package can include multiple compute nodes and intra-chip bidirectional photonic channels interconnecting the compute nodes.
Claims19
A circuit package comprising:
- a photonic integrated circuit having a first surface, the photonic integrated circuit comprising
- an optical modulator,
- a detector, and
- an optical waveguide connecting the optical modulator and the detector;
- a first electronic integrated circuit on the first surface, the first electronic integrated circuit being electrically coupled to control the optical modulator;
- and
- a second electronic integrated circuit on the first surface and separated from the first electronic integrated circuit, the second electronic integrated circuit being electrically coupled to receive signals from the detector.
4 more elements
Dependencies are inferred from the claim text.