Substrate processing method, substrate processing apparatus, and storage medium

A substrate processing apparatus configured to form a pattern by supplying a developing fluid that is gas or mist to a substrate and developing a resist film formed on the substrate and containing metal, the substrate processing apparatus comprising:

• a heat processing unit configured to perform heat processing on the substrate after the resist film is exposed along the pattern;
• a developing fluid supply unit configured to supply the developing fluid to the substrate;
• and
• a controller configured to output a control signal to perform
• a first developing step of supplying the developing fluid to the substrate on which the heat processing is performed by the heat processing unit and removing a part of the resist film in a depth direction, and
• a second developing step of supplying the developing fluid to the substrate on which the first developing step is performed for forming the pattern and removing a region from which the resist film is removed in the first developing step in the depth direction to a development completion position.