Substrate for producing an optical element, optical element and also semiconductor technology apparatus
AssigneeCarl Zeiss SMT GmbH
InventorsCaren MOELLER, Sebastian FAAS, Martin TIMM, Samer SULEIMAN, Erik LOOPSTRA, Joachim RUCK, Andreas SEIFERT
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Abstract
A substrate for producing an optical element and an optical element are specified. Furthermore, a semiconductor technology apparatus is specified.
Claims20
A substrate for producing a mirror for an EUV projection exposure apparatus, comprising:
- at least one temperature-regulating hollow structure comprising a strongly curved portion which has an angle of curvature of between 60° and 120° and an inner lateral surface, wherein:
- the inner lateral surface which has, at least in some areas, an average roughness Ra in accordance with DIN EN ISO 25178, as of April 2023, of between 10.0 μm and 5.0μm, or the inner lateral surface which has, at least in some areas, an average roughness Ra of 5.0 μm and less.
A substrate for producing a mirror for an EUV projection exposure apparatus, comprising at least one temperature-regulating hollow structure that defines an inner lateral surface which has a surface topography of which a geometric shape results from an overlaying, at least in some areas, of sunken structures which extend into a substrate material of the substrate.
A substrate for producing an optical element for an EUV semiconductor technology apparatus, comprising
- temperature-regulating hollow structures, and
- a carrier surface for a coating,
- wherein the substrate has a lifetime of two or more years during which a surface figure of the carrier surface changes by less than 100 pm.
An optical element for an EUV semiconductor technology apparatus, comprising a substrate with a lifetime of two years or more years during which a surface figure of the optical element changes by less than 100 pm.
Dependencies are inferred from the claim text.