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US 2026/0104388 A1Published application
Bio sensor having thermal dissipation via coil layout
AssigneeAllegro MicroSystems, LLC
InventorsGuillermo Airaldi, Rémy Lassalle-Balier, Jorge Gabriel Varela Kuolas
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Abstract
Example embodiments provide for a magnetic field bio sensor having a first coil with first and second portions on different metal layers connected by first vias and a second coil having first and second portions on different ones of the metal layers connected by second vias. The second portion of the first coil overlaps with the first portion of the second coil to promote heat dissipation via an inactive one of the first and second coils and reduce die area.
Claims25
A magnetic field bio sensor, comprising:
- a first coil having first and second portions on different metal layers, wherein the first and second portions of the first coil are connected by first vias;
- and
- a second coil having first and second portions on different ones of the metal layers, wherein the first and second portions of the second coil are connected by second vias,
- wherein the second portion of the first coil overlaps with the first portion of the second coil to promote heat dissipation via an inactive one of the first and second coils.
1 more element
A method, comprising:
- forming a first coil having first and second portions on different metal layers, wherein the first and second portions of the first coil are connected by first vias;
- and
- forming a second coil having first and second portions on different ones of the metal layers, wherein the first and second portions of the second coil are connected by second vias, wherein the first and second coils form part of a magnetic field bio sensor,
- wherein the second portion of the first coil overlaps with the first portion of the second coil to promote heat dissipation via an inactive one of the first and second coils.
1 more element
Dependencies are inferred from the claim text.